{"title":"Plastic Packages","description":"","products":[{"product_id":"sop-to-plastic-package-exposed-heatsink","title":"SOP \/ TO Series Plastic Encapsulated IC Packages with Exposed Heatsink","description":"\u003cdiv class=\"industrial-highlight-box\"\u003e\n\u003cp\u003eThe SOP \/ TO Series Plastic Encapsulated IC Packages feature an advanced exposed heatsink design, engineered specifically for high-power applications requiring rigorous thermal management.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eThermal Advantage:\u003c\/strong\u003e Delivers superior thermal stability, with operating temperature thresholds approximately \u003cstrong\u003e10°C+ higher\u003c\/strong\u003e than standard commercial-grade plastic packages.\u003c\/p\u003e\n\u003c\/div\u003e","brand":"SANJIN ELECTRONICS","offers":[{"title":"Default Title","offer_id":44300768870442,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0678\/1255\/6842\/files\/SOP-44_and_TO-220-7_plastic_encapsulated_IC_packages_with_exposed_heatsink_for_Power_Amplifiers.png?v=1777620745"}],"url":"https:\/\/www.sanjinelectronics.com\/collections\/plastic-packages.oembed","provider":"SANJIN ELECTRONICS","version":"1.0","type":"link"}