{"title":"Shims \u0026 Interposers","description":"","products":[{"product_id":"cu-al-transition-pads-wire-bonding","title":"Cu-Al Transition Pads for High-Power Wire Bonding","description":"\u003cdiv class=\"industrial-highlight-box\"\u003e\n\u003cp\u003eEngineered to solve the reliability challenges of directly bonding aluminum wires to copper substrates, our bimetallic transition pads provide the ultimate interface for high-power and high-frequency electronics.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eIntermetallics Elimination:\u003c\/strong\u003e By providing a pure aluminum top surface and a highly solderable oxygen-free copper base, these pads completely eliminate the formation of brittle Cu-Al intermetallic compounds, drastically increasing device lifetime and thermal stability.\u003c\/p\u003e\n\u003c\/div\u003e","brand":"SANJIN ELECTRONICS","offers":[{"title":"Default Title","offer_id":43470395277354,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0678\/1255\/6842\/files\/Multi-layer_Cu-Al_transition_pad_structure_for_IGBT_wire_bonding.png?v=1777791261"}],"url":"https:\/\/www.sanjinelectronics.com\/collections\/shims-interposers.oembed","provider":"SANJIN ELECTRONICS","version":"1.0","type":"link"}