A record of capability built over time

Since 1997, Sanjin’s history has been shaped by steady expansion in materials knowledge, tooling capability, certified systems, and high-reliability semiconductor packaging.

Three stages of manufacturing depth

Sanjin's capabilities developed through ceramic packaging, precision metal stamping, certified systems, and advanced hermetic packaging.

An engineering-led start in ceramic packaging

Sanjin began in Nanping with ceramic package components, then built early strength around technical appraisal, quality systems, and patented package structures.

1997

Sanjin Electronics was established in Nanping, Fujian.

2004

ISO 9001 certification obtained. The company also received provincial recognition for technical innovation.

2005

Metal lids for SMD ceramic oscillators passed national-level technical appraisal.

2006

Black ceramic flat packages passed technical appraisal. A related utility patent for low-temperature glass IC package lead-frame structure was granted.

2007

Received the Cross-Strait Workers' Innovation Silver Award.

Precision stamping becomes a production strength

As electronics manufacturing expanded, Sanjin moved deeper into precision metal lids, tooling, production systems, and recognized research capability.

2008

Recognized as a National High-Tech Enterprise. Sanjin also moved into a new facility in the Nanping High-Tech Zone.

2011

Invention patent granted for electronic packaging metal lid production. Sanjin was also recognized as a Fujian innovative enterprise.

2013

Engineering research center for ceramic packaging materials recognized. Sanjin also received the Cross-Strait Workers' Innovation Gold Award.

2016

Recognized as an intellectual property advantage enterprise in Nanping. Manufacturing and safety management systems continued to mature.

Advanced packaging becomes the next platform

Sanjin extended its material, tooling, and process experience into IC packaging, hermetic structures, and higher-reliability package programs.

2017

IC packaging project launched.

2018

High-reliability black ceramic low-melting glass IC packaging line built. Sanjin was also recognized as a specialized niche enterprise in Fujian.

2019

Awarded leading technology niche enterprise recognition.

2020

Recognized as a national specialized niche enterprise. Chuangxin Microelectronics was established in Fuzhou.

2022

IATF 16949 certification obtained. The quality system was strengthened for demanding customer programs.

2023

Recognized as a Nanping innovation and transformation enterprise model.