1997
Sanjin Electronics was founded
Sanjin Electronics was founded in Nanping, Fujian, establishing its early focus on precision electronic packaging components.
A record of capability built over time.
Since 1997, Sanjin’s history has been shaped by steady expansion in materials knowledge, tooling capability, certified systems, and high-reliability semiconductor packaging.
Capability built through successive milestones.
Sanjin’s development has been marked by practical steps in materials, tooling, certification, automation, and advanced packaging capability.
1997-2004
Foundation in ceramic packaging
2002
Corning supplier certification
Supplier certification from Corning Communications marked an early step into higher-standard customer supply chains.
2003
Tsinghua Unigroup ecosystem
Sanjin became a certified supplier to Tangshan Jingyuan Yufeng Electronics, then part of Tsinghua Unigroup’s semiconductor ecosystem.
2004
ISO 9001 and technical innovation
The company obtained ISO 9001 quality system certification and received a provincial employee technical innovation award.
2005-2016
Process capability and certified growth
2005
MOST certification
Sanjin’s metal lid for SMD ceramic crystal packages received certification from China’s Ministry of Science and Technology.
2006
Black CFP and patent approval
The Black Ceramic Flat Package was certified, and Sanjin received a utility model patent for IC low-temperature glass package lead frames.
2008
National High-Tech Enterprise
Sanjin was recognized as a National High-Tech Enterprise and moved into a newly built facility in the High-Tech Development Zone.
2013
Environmental certification and research center
The company obtained environmental management certification and was designated as a Provincial Engineering Research Center for Ceramic Packaging Materials.
2014-2016
Operational systems strengthened
Sanjin continued to renew its National High-Tech Enterprise status while strengthening work safety and operational management systems.
2017-2025
Advanced packaging and high-volume systems
2017
Advanced IC packaging roadmap
Sanjin formally initiated its roadmap for advanced integrated circuit packaging components.
2018
High-reliability ceramic production
A high-reliability black ceramic production line was commissioned, and Sanjin was recognized as a Provincial SRDI enterprise.
2020
National SRDI “Little Giant” enterprise
Sanjin was recognized as a National SRDI “Little Giant” Enterprise and established Fujian Chuangxin Microelectronics as a new subsidiary.
2021
Automation and process control expansion
Automated production lines with high-speed presses and CCD optical inspection were commissioned to expand production capacity and process control.
2022
IATF 16949 certification
The company achieved IATF 16949 certification, supporting entry into automotive-grade supply chain requirements.
2025
GTMS multi-sector application
GTMS technology reached mature multi-sector application, extending Sanjin’s hermetic packaging capability across advanced industries.
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