Ceramic Packages

LCC / CQFN Ceramic Packages for RF & Microwave

Engineered for extreme miniaturization and maximum electrical performance, our LCC/CQFN (Ceramic Leadless Chip Carrier) packages are the definitive choice for RF, microwave, and high-spe...

View details →

Ceramic Flat Pack (CFP) for High-Reliability SMT

Engineered for uncompromising long-term reliability, the Ceramic Flat Pack (CFP) provides superior hermetic protection for sensitive integrated circuits in high-density Surface Mount Tec...

View details →