Hermetic Sealing and Ceramic Integration

Metal, glass, ceramic, and conductive paths integrated for protected electronic packages.

Reliability is built at the interface

Hermetic sealing and ceramic integration depend on how sealing boundaries, metallized surfaces, conductive paths, and the surrounding environment are controlled together.

Protected device environment

Metal-glass seal

Controls the sealing boundary between metal structure, glass material, and external exposure.

Ceramic metallization

Creates prepared surfaces for joining, plating, and reliable electrical transition.

Conductive routing

Maintains electrical paths through vias, castellation, and metallized features.

Environmental isolation

Protects sensitive electronics from moisture, pressure, contamination, and thermal stress.

Two package platforms. One reliability logic.

Whether the structure is sealed through glass-to-metal fusion or built on metallized ceramics, reliability depends on controlling how materials meet, conduct, insulate, and survive over time.

Glass-to-metal seal model

Glass-to-metal sealing

For sealed feedthroughs and protected package structures where metal, glass, and conductive pins must remain stable under thermal, electrical, and environmental stress.

Sealing boundary

Managing the contact interface between glass, metal, and conductive pins to support leak-tight performance.

Thermal behavior

Controlling furnace profile, glass flow, and cooling conditions to reduce stress caused by expansion mismatch.

Controlled cooling profile

Electrical isolation

Maintaining insulation between conductive paths and package structure under demanding operating conditions.

Environmental protection

Supporting sealed structures that protect internal electronics from moisture, pressure, and contamination.

Metallized ceramic circuit model

Metallized ceramic integration

For ceramic platforms that require metallized surfaces, conductive routing, vias, or castellation features to connect electrical paths across compact package geometry.

Metallized surface

Preparing ceramic surfaces for stable bonding, plating, and conductive layer formation.

Conductive routing

Supporting electrical continuity through vias, edge features, and metallized paths across the ceramic body.

Structural stability

Managing substrate behavior under heat and processing conditions so geometry remains suitable for assembly.

Interface compatibility

Aligning metallization, plating, and joining requirements with the final package environment.

Technical specifications

Glass-to-Metal Sealing

Hermeticity Limit
≤ 1×10⁻⁹ atm·cc/sec
Insulation Resistance
≥ 10,000 MΩ @ 500VDC
Pin Materials
Kovar (F-15), Alloy 52, 4J29
Glass Systems
Borosilicate, soda-barium, matched sealing glass
Process Control
Glass flow, sealing gap, furnace profile, controlled cooling

Ceramic Integration

Base Substrate
Al₂O₃ 96% - 99%, AlN
Metallization Systems
W / Mo / AgPd conductive systems
Line / Space Resolution
≥ 50 μm / 50 μm
Structural Features
Multi-layer routing, blind / buried vias, castellation
Adhesion Strength
≥ 80 MPa pull-test reference
MIL-STD-883

Validation before release

Sealed and ceramic package structures are checked through in-house inspection, metrology, and reliability testing before release.

  • Helium leak detection

    Verifies hermetic sealing performance for structures requiring environmental isolation.

  • Insulation resistance testing

    Checks electrical isolation between conductive paths, package structure, and metallized ceramic features.

  • Thermal shock cycling

    Evaluates material-interface stability under rapid temperature transitions.

  • Optical dimensional metrology

    Measures critical geometry, surface features, coplanarity, and structural tolerances.

  • XRF and plating inspection

    Checks plating thickness, surface consistency, and interface readiness for bonding or assembly.