High-Power Plastic Packaging

Molded package structures engineered around thermal dissipation, material stability, and production-ready tooling.

HSOP plastic package model with exposed heat sink

Built to move heat out

Exposed heat-sink architecture creates a shorter thermal path from the device area to the PCB, improving operating headroom for high-current applications.

+10°C Operating headroom compared with conventional plastic package structures.

Start from a proven package platform

Sanjin supports established TO and SOP package platforms, with custom tooling when pin count, thermal path, or package geometry requires a dedicated structure.

TO Series

For high-current package structures requiring robust thermal paths and exposed heat-sink architecture.

TO-220-7 TO-263-7 TO-247-3/4 Roadmap

SOP Series

For surface-mount molded packages where pin count, lead geometry, and assembly format can match mature tooling.

SOP-20 SOP-24 SOP-44

Custom high-power formats

For exposed-heat-sink layouts, lead-frame variations, and project-specific molded package geometry.

Custom lead frames Dedicated molds Project-specific tooling

Tooling route

Sanjin first checks whether the package can use an existing platform, then decides how much tooling work is actually needed.

01

Existing platform

If a mature TO, SOP, or HSOP cavity fits the device requirement, the project can avoid full new mold development.

02

Partial NRE

When the package body is close, Sanjin can focus tooling work on the changed area, such as lead-frame layout, pin arrangement, heat-sink detail, or local cavity adjustment.

03

Dedicated tooling

If the geometry, thermal path, die area, or assembly format cannot match an existing platform, a dedicated tooling route is developed.

Technical specifications

Process Capabilities

Material Form
Die / wafer support for 6-inch, 8-inch, and 12-inch wafers
Chip Size Capability
0.45 × 0.45 mm to 10.00 × 10.00 mm; thickness ≥ 0.15 mm; kerf width ≥ 60 μm
Bonding Pad Requirements
Minimum pad size 50 μm; minimum pitch 55 μm; minimum thickness 0.80 μm
Die Attachment
Solder, conductive / insulating adhesive, and DAF bonding; max. sideway overflow 0.25 mm

Assembly Support

Wire Bonding
Cu / Au wire 20-50 μm or Al wire 20-500 μm; loop height control ≥ 0.10 mm
Lead Frame & Plating
Lp tolerance control 0.10 to 0.15 mm; pure tin plating, 5 to 12 μm thickness
Advanced Support
Chip stacking, multi-chip packaging, and project-specific assembly requirements
Laser Marking
Marking depth ≥ 80 μm
Target applications
  • Power Amplifiers
  • Electric Drive Systems
  • Power Management Modules

Built for high-current package programs

Sanjin supports molded package structures used in power amplifiers, electric drive systems, PMICs, and other high-current applications.

  • RF and communications
  • Automotive and industrial
  • Power management
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