High-Power Plastic Packaging.

Molded package structures engineered around thermal dissipation, material stability, and production-ready tooling.

HSOP plastic package model with exposed heat sink

Built to move heat out.

Exposed heat-sink architecture creates a shorter thermal path from the device area to the PCB, improving operating headroom for high-current applications.

+10°C Operating headroom compared with conventional plastic package structures.

Start from a proven package platform.

Sanjin supports established TO and SOP package platforms for high-power molded devices, while also developing custom tooling when pin count, thermal path, or package geometry requires a dedicated structure.

TO Series

For high-current package structures requiring robust thermal paths and exposed heat-sink architecture.

TO-220-7 TO-263-7 TO-247-3/4 Roadmap

SOP Series

For surface-mount molded packages where pin count, lead geometry, and assembly format can be matched to mature tooling.

SOP-20 SOP-24 SOP-44

Custom high-power formats

For exposed-heat-sink layouts, lead-frame variations, and project-specific molded package geometry.

Custom lead frames Dedicated molds Project-specific tooling

Tooling strategy matched to volume and geometry.

Sanjin evaluates each high-power package program around platform fit, mold requirements, sample validation, and production readiness.

Platform fit review

Existing TO, SOP, or HSOP platforms are reviewed against pin count, die area, thermal path, lead-frame layout, and assembly format.

Tooling path

When mature cavities fit the requirement, early development burden can be reduced. When geometry is unique, Sanjin develops dedicated mold tooling in-house.

Sample validation

First articles are checked for dimensional stability, lead geometry, marking quality, and assembly readiness before approval.

Production ramp

Approved structures move into controlled production planning with inspection, traceability, and package consistency requirements defined.

Technical specifications.

Process Capabilities

Material Form
Die / wafer support for 6-inch, 8-inch, and 12-inch wafers
Chip Size Capability
0.45 × 0.45 mm to 10.00 × 10.00 mm; thickness ≥ 0.15 mm; kerf width ≥ 60 μm
Bonding Pad Requirements
Minimum pad size 50 μm; minimum pitch 55 μm; minimum thickness 0.80 μm
Die Attachment
Solder, conductive / insulating adhesive, and DAF bonding; max. sideway overflow 0.25 mm

Assembly Support

Wire Bonding
Cu / Au wire 20-50 μm or Al wire 20-500 μm; loop height control ≥ 0.10 mm
Lead Frame & Plating
Lp tolerance control 0.10 to 0.15 mm; pure tin plating, 5 to 12 μm thickness
Advanced Support
Chip stacking, multi-chip packaging, and project-specific assembly requirements
Laser Marking
Marking depth ≤ 80 μm
Target applications
  • Power Amplifiers
  • Electric Drive Systems
  • Power Management Modules

Built for high-current package programs.

Sanjin supports high-power molded package structures used where thermal dissipation, package stability, and assembly consistency are critical.

RF and communications

Power amplifiers and high-frequency power devices.

Automotive and industrial

Electric drive systems and rugged power electronics.

Power management

PMICs and power modules requiring stable molded package structures.

Explore Plastic Packages Molded high-power package structures and available platforms. →