Engineered for complex, high-pin-count devices such as ASICs and FPGAs, our Ceramic Quad Flat Pack (CQFP) lead frames provide the robust foundation necessary for extreme I/O density. Mat...
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Serving as the reliable internal skeleton for Small Outline Packages (SOP), our precision lead frames deliver the robust structural and electrical foundation required for modern, space-e...
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As a classic and highly reliable packaging format, the Dual In-line Package (DIP) relies entirely on a robust lead frame skeleton. We provide a complete range of metal lead frames for pl...
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