Custom stamped components for lids, frames, shims, thermal pads, and package interfaces when standard catalogs cannot solve the requirement.
Sanjin works from qualified material stock and focuses its engineering work on tooling, forming behavior, dimensional control, plating compatibility, and repeatable stamped output. For designs that do not fit standard catalogs, this is where drawings become manufacturable packaging components.
Stamped cover structures for hermetic and high-reliability package interfaces.
Flat, stepped, folded, dimpled, deep-drawn covers
Kovar, Alloy 42, stainless steel, qualified metal stock
Flatness, burr, edge condition, plating surface
Parallel seam welding, laser welding, soldering interfaces
Package frames, sealing rings, support frames, and custom openings for package assembly.
Open frames, rings, windows, support structures
Kovar, Alloy 42, copper alloys, stainless steel
Opening geometry, flatness, edge quality, dimensional repeatability
Hermetic assemblies, ceramic packages, custom package interfaces
Stamped lead frame structures for package connectivity and high-volume assembly formats.
DIP, SOP, matrix formats, high-density frame layouts
Copper alloys such as C194 and C7025, qualified lead frame stock
Coplanarity, pitch, burr control, handling stability
Tape and reel, trays, project-specific packaging formats
Precision pads, shims, interposers, and bimetal transition pieces stamped from qualified stock.
Shims, micro-coins, thermal pads, copper-aluminum transition pads
Copper alloys, stainless steel, bimetal stock, application-specific metal stock
Thickness, flatness, edge condition, bonding surface handling
Bonding transitions, thermal interfaces, spacing, package support
Lead frames and package interfaces must remain stable enough for downstream assembly and automated handling.
Edges, openings, and stamped profiles must be controlled to reduce assembly risk and protect functional surfaces.
Forming, plating, and handling conditions are reviewed to reduce distortion in thin or complex metal features.
Material stock, forming paths, and die conditions must support repeatable geometry across production lots.
Sealing, soldering, bonding, and contact surfaces must match the package process and downstream requirements.
Carrier format, orientation, inspection flow, and handling stability are considered before high-volume delivery.
Each custom stamping program is planned around the part geometry, application interface, expected volume, and the level of tooling needed to support repeatable output.
We review drawings, material stock, target volume, assembly method, and package interface requirements before quoting the manufacturing path.
Geometry, openings, bends, thickness, burr risk, plating surfaces, sealing areas, and key tolerances are reviewed for stamping feasibility.
Tooling is planned around project stage and production scale. High-volume lid programs may justify automated tooling, while lower-volume or early-stage programs can follow a more flexible tooling route.
Samples and first article inspection confirm dimensions, flatness, edge condition, visual requirements, and critical functional surfaces before ramp-up.
The approved tooling route moves into pilot or volume stamping, with attention to coplanarity, warpage, burr control, and lot-to-lot consistency.
AOI / CCD inspection and project-specific packaging such as Tape & Reel, trays, bulk, or clean handling prepare parts for downstream assembly.
Browse stamped lids, frames, lead frames, shims, interposers, transition pads, and custom precision metal parts.
Whether you need support for custom parts, want to evaluate our manufacturing capabilities, or have a general project question—drop us a line. Our team appreciates every inquiry and will get back to you promptly.
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