Packaging Solutions

Manufacturing paths for precision stamped metal parts, hermetic and ceramic structures, and high-power plastic packaging.

Browse solution paths

Precision Stamping → Hermetic Sealing and Ceramic Integration → High-Power Plastic Packaging →

Start with what you have

Support path stamping / sealing / packaging / custom
Drawing file geometry / tolerance
Device sample chip / module / interface
Project notes material / volume / limits
  • If a drawing is ready, include geometry, material, tolerance, surface requirement, expected quantity, and delivery format.
  • If a device or sample is involved, share chip or module condition, package interface, bonding or assembly needs, and any known restrictions.
  • If the route is unclear, send what you know. Sanjin can review whether the project fits stamping, hermetic or ceramic integration, high-power packaging, or a custom support route.