Ceramic Flat Pack (CFP) for High-Reliability SMT

Ceramic Flat Pack (CFP) for High-Reliability SMT

Engineered for uncompromising long-term reliability, the Ceramic Flat Pack (CFP) provides superior hermetic protection for sensitive integrated circuits in high-density Surface Mount Technology (SMT) applications. With its robust ceramic construction and precision gold-plated leads, this package is the industry standard for mission-critical environments where failure is not an option.

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Datasheet

Technical Specifications

Process Capabilities

  • Hermetic Sealing: High-purity ceramic construction guaranteeing superior moisture and environmental resistance.
  • Lead Pitch Options: Standard 1.27mm pitch, with custom high-density routing options available down to 1.0mm, 0.8mm, and 0.5mm.
  • Material Customization: Available in standard pink, purplish-black, and white ceramic to meet specific regional mil-spec or photosensitive device requirements.
  • Thermal Management: Optional integrated base heat sink for high-power dissipation.
  • Assembly Compatibility: Flat or gull-wing lead configurations optimized for automated SMT production lines and high solder joint reliability.

Applications

  • Aerospace & Defense Electronics (Mil-Spec compliant systems)
  • RF Power Amplifiers & Microwave Modules
  • High-Frequency Oscillators & Filters
  • Implantable Medical Devices
  • Hybrid Integrated Circuits (HIC)

Manufacturing Advantages

Leveraging mature manufacturing processes and precision in-house tooling, Sanjin delivers custom CFP solutions that guarantee superior hermeticity and mechanical resilience. We ensure your sensitive ICs perform flawlessly in the most extreme environmental conditions.