High-Density CQFP Lead Frames (4J42 Fe-Ni Alloy)

• Pin Count Configurations: Available in standard and high-density layouts including 32, 44, 64, 132, 144, and up to 256 lines.
• Manufacturing Precision: Advanced high-speed stamping and precision chemical etching capable of achieving stringent tolerances of ±0.05 mm (±0.002 inch).
• Base Material: High-grade 4J42 Fe-Ni (Iron-Nickel) Alloy, ensuring optimal mechanical strength and excellent CTE matching with ceramic substrates.
• Bonding Pad Surface: Integrated Aluminum Strip cladding provides a pristine, oxidized-free surface optimized for high-reliability aluminum wire bonding.
• Flatness & Pitch Control: Strict raw frame flatness and fine-pitch consistency, guaranteeing exceptional coplanarity post trim-and-form for high-yield SMT assembly.

• ASICs (Application-Specific Integrated Circuits)
• FPGAs (Field-Programmable Gate Arrays)
• High-Density Gate Arrays & Microprocessors
• DSP (Digital Signal Processing) Units
• Aerospace and Defense Electronics

As a specialized manufacturer of high-density lead frames, Sanjin / Chuangxin Microelectronics integrates precision tooling design with advanced stamping and etching processes. Whether producing industry-standard 32-pin layouts or ultra-complex 256-pin frames, our rigorous quality control and material expertise in 4J42 Alloy deliver the precision required for your most demanding, mission-critical IC packaging.