High-Density CQFP Lead Frames (4J42 Fe-Ni Alloy)

High-Density CQFP Lead Frames (4J42 Fe-Ni Alloy)

Engineered for complex, high-pin-count devices such as ASICs and FPGAs, our Ceramic Quad Flat Pack (CQFP) lead frames provide the robust foundation necessary for extreme I/O density. Material & Precision: Manufactured from superior 4J42 Fe-Ni Alloy with critical dimensional tolerances controlled down to ±0.05 mm (±0.002 inch), ensuring exceptional alignment and reliability in aerospace and defense applications.

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Datasheet

Technical Specifications

Process Capabilities

  • Pin Count Configurations: Available in standard and high-density layouts including 32, 44, 64, 132, 144, and up to 256 lines.
  • Manufacturing Precision: Advanced high-speed stamping and precision chemical etching capable of achieving stringent tolerances of ±0.05 mm (±0.002 inch).
  • Base Material: High-grade 4J42 Fe-Ni (Iron-Nickel) Alloy, ensuring optimal mechanical strength and excellent CTE matching with ceramic substrates.
  • Bonding Pad Surface: Integrated Aluminum Strip cladding provides a pristine, oxidized-free surface optimized for high-reliability aluminum wire bonding.
  • Flatness & Pitch Control: Strict raw frame flatness and fine-pitch consistency, guaranteeing exceptional coplanarity post trim-and-form for high-yield SMT assembly.

Applications

  • ASICs (Application-Specific Integrated Circuits)
  • FPGAs (Field-Programmable Gate Arrays)
  • High-Density Gate Arrays & Microprocessors
  • DSP (Digital Signal Processing) Units
  • Aerospace and Defense Electronics

Manufacturing Advantages

As a specialized manufacturer of high-density lead frames, Sanjin / Chuangxin Microelectronics integrates precision tooling design with advanced stamping and etching processes. Whether producing industry-standard 32-pin layouts or ultra-complex 256-pin frames, our rigorous quality control and material expertise in 4J42 Alloy deliver the precision required for your most demanding, mission-critical IC packaging.