Cu-Al Transition Pads for High-Power Wire Bonding

Cu-Al Transition Pads for High-Power Wire Bonding

Engineered to solve the reliability challenges of directly bonding aluminum wires to copper substrates, our bimetallic transition pads provide the ultimate interface for high-power and high-frequency electronics. Intermetallics Elimination: By providing a pure aluminum top surface and a highly solderable oxygen-free copper base, these pads completely eliminate the formation of brittle Cu-Al intermetallic compounds, drastically increasing device lifetime and thermal stability.

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Datasheet

Technical Specifications

Process Capabilities

  • Material Composition: Premium Copper-clad Aluminum alloy, Oxygen-Free Copper, and specialized Fe-Ni alloy options available.
  • Advanced Layer Stack: Capable of manufacturing complex multi-layer structures (e.g., Al / Cu / Ni / Au / Au-Sn) to suit specific reflow and wire bonding requirements.
  • Micro-Precision Sizing: Small-scale dimensional capabilities down to 0.5 x 0.5 mm with strictly controlled, sagging-free edge profiles.
  • Surface Quality: Ultra-smooth, oxidation-free uniform coating with no peeling or bubbling, optimized for ultrasonic wedge bonding.
  • Bonding Strength: Top aluminum layer consistently achieves wire bond pull strengths greater than 5g.
  • Geometric Flatness: Strict manufacturing tolerances achieving ±0.01 mm flatness, ensuring zero voids during substrate attachment.

Applications

  • IGBT and Power MOSFET Modules
  • Automotive Power Electronics (Inverters & Converters)
  • High-Power IC Packaging
  • RF and Microwave Modules
  • High-Brightness LED (HB-LED) Packaging
  • Hybrid Integrated Circuits (HIC)

Manufacturing Advantages

As a strategic supplier for advanced semiconductor packaging, Sanjin engineers transition pads that guarantee a high-yield, repeatable manufacturing process. Our precision bimetallic pads not only solve critical interconnect failure points in power electronics but are also seamlessly integrated into your automated workflows. Supplied in custom tape-and-reel packaging, our transition pads enable high-speed, high-volume pick-and-place assembly with absolute consistency and minimal manual intervention.