DIP Lead Frames & CERDIP Substrates (8 to 40 Pins)

DIP Lead Frames & CERDIP Substrates (8 to 40 Pins)

As a classic and highly reliable packaging format, the Dual In-line Package (DIP) relies entirely on a robust lead frame skeleton. We provide a complete range of metal lead frames for plastic encapsulation, alongside premium Black Ceramic (CERDIP) substrates for extreme hermeticity. Material & Hermeticity: Choose from high-conductivity Copper Alloys (C194/C7025) for standard applications, or CTE-matched 4J42 Fe-Ni alloy specifically engineered for our low-temperature glass frit sealed ceramic packages, delivering unmatched corrosion resistance and thermal management. DIP & CERDIP Packaging Solutions Overview: As a classic and highly reliable packaging format, the Dual In-line Package (DIP) relies entirely on a robust lead frame skeleton. We provide a complete range of metal lead frames for plastic encapsulation, alongside premium Black Ceramic (CERDIP) substrates for extreme hermeticity. Material & Hermeticity: Choose from high-conductivity Copper Alloys (C194/C7025) for standard applications, or CTE-matched 4J42 Fe-Ni alloy specifically engineered for our low-temperature glass frit sealed ceramic packages, delivering unmatched corrosion resistance and thermal management. Download DIP Specification Datasheet (.xlsx)

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Datasheet

Technical Specifications

Process Capabilities

  • Pin Configurations: Comprehensive standard specifications ranging from 8 to 40 pins.
  • Base Materials: High-performance Copper Alloys (C194/C7025) for excellent thermal conductivity, and 4J42 Fe-Ni alloy for precise CTE matching.
  • Manufacturing Precision: High-speed precision stamping and etching maintaining strict dimensional tolerances of ±0.05mm for flawless automated die-attach and wire bonding.
  • CERDIP Sealing (Glass Frit): Black ceramic low-temp glass frit sealing process available, offering excellent hermeticity and high corrosion resistance.
  • Cavity & Lid Options: Selection of base cavity sizes with optional Gold (Au) plating. Compatible with standard lids or specialized optical window lids.
  • Production Flexibility: Process optimized for both massive high-volume stamping and agile, quick-turnaround small batch production.

Applications

  • Operational Amplifiers (Op-amps) & Logic Gates
  • Microcontrollers (MCUs) & Memory ICs
  • Optical Sensors (Using window lids)
  • High-Reliability Industrial Control Modules
  • Automotive Electronics & Sensors
  • Harsh Environment Military/Aerospace Devices

Manufacturing Advantages

Drawing upon years of high-volume manufacturing experience, Sanjin Electronics offers mature, field-proven solutions for both standard plastic DIP lead frames and high-reliability Black Ceramic DIPs. Our proven glass frit sealing processes ensure that even your most sensitive ICs receive superior hermetic protection. We maintain an extensive catalog of ready-to-ship specifications while fully supporting NRE investments to co-develop deeply customized cavity designs, pin layouts, and plating configurations tailored to your proprietary chip architecture.