DIP Lead Frames & CERDIP Substrates (8 to 40 Pins)

• Pin Configurations: Comprehensive standard specifications ranging from 8 to 40 pins.
• Base Materials: High-performance Copper Alloys (C194/C7025) for excellent thermal conductivity, and 4J42 Fe-Ni alloy for precise CTE matching.
• Manufacturing Precision: High-speed precision stamping and etching maintaining strict dimensional tolerances of ±0.05mm for flawless automated die-attach and wire bonding.
• CERDIP Sealing (Glass Frit): Black ceramic low-temp glass frit sealing process available, offering excellent hermeticity and high corrosion resistance.
• Cavity & Lid Options: Selection of base cavity sizes with optional Gold (Au) plating. Compatible with standard lids or specialized optical window lids.
• Production Flexibility: Process optimized for both massive high-volume stamping and agile, quick-turnaround small batch production.

• Operational Amplifiers (Op-amps) & Logic Gates
• Microcontrollers (MCUs) & Memory ICs
• Optical Sensors (Using window lids)
• High-Reliability Industrial Control Modules
• Automotive Electronics & Sensors
• Harsh Environment Military/Aerospace Devices

Drawing upon years of high-volume manufacturing experience, Sanjin Electronics offers mature, field-proven solutions for both standard plastic DIP lead frames and high-reliability Black Ceramic DIPs. Our proven glass frit sealing processes ensure that even your most sensitive ICs receive superior hermetic protection. We maintain an extensive catalog of ready-to-ship specifications while fully supporting NRE investments to co-develop deeply customized cavity designs, pin layouts, and plating configurations tailored to your proprietary chip architecture.