Kovar Metal Lids for Hermetic Packaging

• Stepped Lids: Dual-stage stamped or etched designs that raise the center area, providing increased internal clearance for taller components while enhancing structural rigidity.
• Stamped Flat Lids: Formed in a single step using high-precision tooling; the industry standard for highly consistent, cost-effective hermetic sealing.
• Folded Lids: Custom-formed geometries optimized for specific package outlines and specialized sealing processes.
• Base Material: Premium Kovar Alloy (ASTM F-15) delivering a precise Coefficient of Thermal Expansion (CTE) match with Alumina (Al₂O₃) ceramic to prevent thermal cycling fatigue.
• Plating & Finish: Dense, uniform coatings with optional Gold (Au) plating to ensure superior corrosion resistance.
• Sealing Compatibility: Surfaces highly optimized for extreme-yield Parallel Seam Welding and Gold-Tin (AuSn) eutectic soldering.

• Hybrid Microcircuits (HIC)
• RF and Microwave Modules
• Optical Communication Packages
• Sensors & MEMS Devices
• Crystal Oscillators & SAW Filters
• Military & Aerospace Electronics

As a vertically integrated manufacturer, Sanjin Electronics controls the entire lid production lifecycle—from precision tooling and high-speed stamping to advanced surface finishing. Operating four independent Electroless Nickel Plating (ENP) production lines in-house, we ensure absolute batch-to-batch consistency, superior plating density, and rapid turnaround times. Whether you require standard flat lids or complex custom-stepped geometries, our robust manufacturing infrastructure guarantees reliable hermetic sealing solutions at scale.