LCC / CQFN Ceramic Packages for RF & Microwave

LCC / CQFN Ceramic Packages for RF & Microwave

Engineered for extreme miniaturization and maximum electrical performance, our LCC/CQFN (Ceramic Leadless Chip Carrier) packages are the definitive choice for RF, microwave, and high-speed digital circuits....

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Datasheet

Technical Specifications

Process Capabilities

  • Footprint Optimization: True leadless design matching the die cavity dimensions for ultimate PCB space conservation in mobile and portable devices.
  • Interconnect Path: Ultra-short electrical pathways via bottom pads, minimizing signal reflection and loss at high frequencies.
  • Solder Joint Inspection: Metallized edge castellations promote optimal solder wicking, enabling highly reliable joints and facilitating easy Automated Optical Inspection (AOI).
  • Thermal Management: Robust Alumina (Al₂O₃) ceramic construction coupled with a wide bottom pad array for rapid, efficient heat transfer directly to the PCB.
  • Hermeticity: Fully hermetic ceramic-to-metal or glass-to-metal sealing compatibility for harsh environments.

Applications

  • RF Power Amplifiers & Transceivers
  • High-Frequency Oscillators & Frequency Synthesizers
  • Optical Transceiver Modules
  • High-Speed Digital Signal Processing (DSP)
  • Satellite Communications
  • MEMS & SAW (Surface Acoustic Wave) Devices

Manufacturing Advantages

As a leading provider in high-reliability packaging, Sanjin offers a comprehensive portfolio of LCC/CQFN solutions. From standard configurations (e.g., CLCC-6, CLCC-20, CLCC-40) to fully custom pin-counts and cavity sizes, our automated manufacturing and strict quality control ensure your most compact, high-speed applications achieve ultimate performance and long-term stability.