SOP / TO Series Plastic Encapsulated IC Packages with Exposed Heatsink

SOP / TO Series Plastic Encapsulated IC Packages with Exposed Heatsink

The SOP / TO Series Plastic Encapsulated IC Packages feature an advanced exposed heatsink design, engineered specifically for high-power applications requiring rigorous thermal management. Thermal Advantage: Delivers superior thermal stability, with operating temperature thresholds approximately 10°C+ higher than standard commercial-grade plastic packages.

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Datasheet

Technical Specifications

Process Capabilities

  • Material Form: Die / Wafer (Support for 6-inch, 8-inch, 12-inch wafers)
  • Chip Size Capability: 0.45 x 0.45 mm to 10.00 x 10.00 mm (Thickness: ≥ 0.15 mm, Kerf Width: ≥ 60 um)
  • Bonding Pad Requirements: Min. Pad Size 50 um / Min. Pad Pitch 55 um / Min. Thickness 0.80 um
  • Die Attachment: Solder, Conductive/Insulating Adhesive, and DAF Bonding (Max. Sideway Overflow: 0.25 mm)
  • Wire Bonding: Cu / Au (20-50 um) or Al (20-500 um) with ≥ 0.10 mm loop height control
  • Lead Frame & Plating: Lp tolerance control 0.10 to 0.15 mm; Pure Tin plating (5 to 12 um thickness)
  • Advanced Support: Support for Chip Stacking, Multi-Chip Packaging (MCP), and laser marking (depth ≤ 80 um)

Applications

  • TO Series: TO-220-7, TO-263-7 (TO-247-3/4 roadmap included)
  • SOP Series: SOP-20, SOP-24, SOP-44
  • Target Application: Power Amplifiers (PA)
  • Target Application: Electric Drive Systems
  • Target Application: Power Management Modules (PMIC)

Manufacturing Advantages

Leveraging our extensive library of in-house precision molds, we offer cavity-matching logic for significant cost optimization. Many designs requiring lower pin-counts (e.g., 10-pin or 20-pin) can be effectively accommodated within our standard higher-pin-count housings (such as SOP-44). This approach drastically reduces lead times and initial NRE investment. Full custom mold development is also available. Consult our application engineers to optimize your design and align your project budget with existing tooling.